Detailed Info
Product features & application
- Rough / rough-grooved surface giving high adhesion to render and adhesive
- Shiplap edge profile eliminating thermal bridging at joints
- Low thermal conductivity of 0.035 – 0.038 W/mK
- High compressive strength in the CS(10/Y)150 – CS(10/Y)300 range
- Closed-cell structure with WL(T)0.7 long-term water absorption class
- DS(23,90) dimensional stability
- Robust board that does not break down or crumble under load
- Manufactured in accordance with TS EN 13164+A1
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